Reducing variation in manufacturing, monitoring behavior over time, and targeting specific workloads can have a big impact on ...

Multi-die assemblies give chip architects the option to change some dies while keeping the rest of the system intact, but ...

Every new SoC tape-out demands broader coverage for design robustness, and the characterization workload has exploded. The ...

Researchers from Yale University, Cornell University, Boston University, and NTT Research have published “Physical Foundation Models: Fixed hardware implementations of large-scale neural networks”.

As high-NA EUV approaches, mask makers need new metrics, model-based checks, and curvilinear-native data flows to keep turn ...

Thermal management has become the defining bottleneck in high-performance computing (HPC) and AI accelerator packaging. Modern packages integrate high-power ASICs with multiple High Bandwidth Memory ...

Exhaustive proofs are the only way to find deep corner-case bugs that can result in deadlocks and silent data corruption.

Semiconductor Engineering sat down to discuss memory interfaces, interconnects, and memory access scaling with Madhumita Sanyal, senior director of technical product management at Synopsys; Swadesh ...

Details Event Category: Events Location: Santa Clara Website: https://pr.tsmc.com/english/events/tsmc-events ...

Researchers from Micron Technology and Argonne National Laboratory have released “Understanding Inference Scaling for LLMs: ...

Over the past decade or so, foundation models have emerged as the dominant paradigm for interacting with language, images, ...

Precision Time Measurement; blockchain-based traceability; simulation in space; 6G PHY co-design.